Advanced Probe Card Cleaning Technologies
Maximise wafer test yield, stabilise contact resistance, and extend probe card life with precision cleaning solutions engineered for semiconductor testing.
Precision Cleaning for Reliable Wafer Testing
Probe tip contamination is one of the leading causes of unstable contact resistance (CRES), inaccurate measurements, and reduced wafer test yield. Gel-Probe™ cleaning technology removes debris without damaging delicate probe tips, delivering cleaner contacts, greater test efficiency, and more reliable electrical performance.
Why Probe Card Cleaning Matters
During wafer testing, contaminants accumulate on probe tips and affect electrical contact between the probe and device. Even minor contamination can lead to unstable CRES, false failures, lower first-pass yield, and unnecessary production downtime.
Stabilize CRES & Eliminate Debris:
Maximize efficiency by removing contaminants and stabilizing parametric Contact Resistance (CRES).
Engineered for High-Performance Probe Cleaning
Gel-Probe™ combines advanced elastomer technology with precision engineering to safely remove contaminants while protecting delicate probe structures. Unlike conventional cleaning methods, its proprietary material applies force only in the vertical (Z-axis), eliminating debris without introducing damaging lateral stress.
Your Innovation Partner for Test Efficiency
Our Gel-Probe™ line combines advanced material science and precision engineering to remove debris, stabilise CRES, protect probe tips, and deliver cleaner contacts with higher test efficiency.
Prolong Probe Card Life
Our proprietary elastomer cleans using vertical (Z-axis) force only, removing debris without lateral stress to protect probe tips and extend probe card life.
Improve Test Yield & Accuracy
Gel-Probe™ removes debris and stabilises contact resistance (CRES), improving probe-to-pad alignment, test accuracy, and overall wafer test yield.
Superior High-Temperature Performance
Reliability. From 60°C to +200°C. Whether testing in cold or extreme heat, Gel-Probe delivers consistent cleaning performance.
Unmatched Material Science Expertise
45 Years of Elastomer Innovation. Gel-Pak is more than a manufacturer; we are a team of chemists and engineers dedicated to solving complex challenges. With decades of experience in elastomer technologies, we customize formulation and processing conditions to meet the requirements of today’s leading test companies.
Gel-Probe™ vs Competition
Feature | Gel-Probe™ | Competition |
|---|---|---|
Surface Texture | Uniform For Optical Recognition | Variable and Inconsistent |
Substrate | Polyimide (-60℃ to 200℃) | Polyester (Limited to 105℃) |
Outgassing | Meets/ Exceeds ASTM E595 | Unknown/ Not Rated |
Engineered Material Construction
Every Gel-Probe™ product is built with precision-engineered layers, combining advanced cleaning elastomers, high-temperature adhesives, and durable carrier materials to deliver consistent cleaning performance and long-term reliability.
Feature | Gel-Probe™ Refine | Gel-Probe™ Remove | Gel-Probe™ Recover |
|---|---|---|---|
Primary Function | Polishing & Debris Removal | Debris Removal | Cleaning, Polishing & Reshaping |
Material Composition | Proprietary Gel Elastomer Blended with Abrasive Particles | Proprietary Non-Abrasive Gel Elastomer | Proprietary Gel Elastomer Blended with Abrasive Particles |
Abrasive Loading | L3, M3, H3, U3, H5, H10 | N/A | U5, U10 |
Available Form Factors | Sheets, 200mm & 300mm Wafer | Sheets, 200mm & 300mm Wafer | Sheets, 200mm & 300mm Wafer |
Operating Temperature | -60℃ to 200℃ | -60℃ to 200℃ | -60℃ to 200℃ |
Need Technical Advice or Product Information?
Whether you’re looking for detailed product specifications or guidance on selecting the right Gel-Probe™ solution, our team is here to help.