Precision Wafer Testing Starts Here
Deliver consistent contact performance and reduce test variability with advanced probe card cleaning solutions.
Advanced Probe Card Cleaning Technology
Featuring proven Gel-Probe™ solutions from Gel-Pak, engineered for high-performance wafer test environments.
Eliminate False Fails. Protect Your Yield.
Probe contamination causes unstable contact resistance (CRES), leading to inaccurate results and costly yield loss. Acceltest helps you stay in control.

Why Cleaning Matters

Probe tip contamination leads to unstable contact resistance (CRES), resulting in false failures and yield loss. Even a 1% drop in first-pass yield can translate into significant revenue impact for semiconductor manufacturers.

Stable Contact Integrity for Reliable Testing

Maintain consistent CRES to reduce false fails and improve test accuracy.

Extended Probe Card Lifetime

Minimise wear and contamination to support longer high-volume usage.

Controlled Contamination at Probe Interface

Reduce particle interference for stable, repeatable measurements.

Higher Uptime & Equipment Efficiency

Increase prober availability by reducing cleaning-related downtime.

Our Products

Designed for different cleaning requirements across wafer test applications:

Elastomer Probe Card Cleaning Films

Gel-Probe Card Cleaning

  • Custom coating of highly engineered elastomer films for semiconductor applications.
  • Customizable probecard cleaning wafer and cleaning sheet applications.

Universal & Pocketless Carriers

Textured Device Carrier Products

  • Pocketless carriers and transport products for KGD and other devices
  • Universal Fixture for device handling in-
    process, singulated die testing, and shipping.

Small Die Shipping & Handling

Vacuum Release Carriers

  • Automated pick & place applications for bare die and devices ranging from <250 micron to 75mm in size.
  • Handling small components or large assembled modules.
  • Suitable for transport and handling MEMs Probes.

Die Wafer & Panel Shipping & Handling

Large Substrate Vacuum Release Carriers™

  • Shipping and handling full or partial wafers, panels, and OTHER substrates from 75mm to 450mm.
  • Suitable for KGD, singulated die, and film frame loaded devices.

Your Partner in Test Yield Optimization

At Acceltest, we provide high-performance solutions for wafer testing environments—helping fabs reduce contamination, stabilise contact resistance, and maximise first-pass yield. Our portfolio includes proven technologies from global leaders like Gel-Pak.

Optimise Your Test Performance Today

Looking to improve wafer test yield and reliability? Contact our team for the right solution.